View LGHK100547NJ_6946221.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

220 hk 212510 _ t j n 1 2 3 4 5 goy ordering code ;my applications ??y features 0603 f 0201 g 0.6 p 0.3 1005 f 0402 g 1.0 p 0.5 1608 f 0603 g 1.6 p 0.8 2125 f 0805 g 2.0 p 1.2 hk ? *t
u
??????? hkq ? *t
u
??????? high q ??? ~o ??.q`o z ??w?m ag ??;`z?s q ?
qq~? *t
:?
q??q ~
u
3???ot??z?
\?
qz? ?z????????0 ~t?3???wh?z?m ?t
q?b? y multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent q and srf characteristics. y designed to address surface mount inductor needs for applications above 100mhz. y multilayer block structure ensures outstanding reliability, high productivity and product quality. y portable telephones, phs and pagers y miscellaneous high-frequency circuits y emi countermeasure in high-frequency circuits. ? *t
u
??????? multilayer chip inductor for high frequency hk series ~3?z phs z???? ~fww? *ts?z *t
? ?s? ~? *t3?pw emi 0f 1 4 ???????0) h m 3 l j m 5 l c m 0.2nh s m 0.3nh ? ??????? h nh i 3 2 hk multilayer chip inductors for high frequency hkq multilayer chip inductors for high frequency high q version 1 type 4 inductance tolerances h m 3 l j m 5 l c m 0.2nh s m 0.3nh nominal inductance h n h i 3 2 external dimensions h mm i 0603 f 0201 g 0.6 p 0.3 1005 f 0402 g 1.0 p 0.5 1608 f 0603 g 1.6 p 0.8 2125 f 0805 g 2.0 p 1.2 3n9 3.9 10n 10 r10 100 r12 120 3n9 3.9 10n 10 r10 100 r12 120 *r=decimal point *n=0.0 f nh type g example f r w ?
:: f n w nh q`ow ?
:: ? y
go f l p w gh mm i k t tape & reel t ???a?e?? a
5 packaging 5 0603 d ? 55 v 125 c operating temp. 1005 d ? 55 v 125 c ? ? yyy ? 55 v 85 c ? ? 1608 d ? 40 v 85 c 2125 d ? 40 v 85 c ? ?- at??!???b{ ? ? operating temperature depends on rated current. ? hk0603, hk1005 ? ?x ? except for hk0603, hk1005
ferrite products 5 221 ?
goy external dimensions p.222 p.224 p.258 p.260 p.268 ?3???? selection guide p.12 ?t??3??y available inductance range ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions etc unit d mm f inch g type l w t e hk0603 0.6 m 0.03 0.3 m 0.03 0.3 m 0.03 0.15 m 0.05 f 0201 g f 0.024 m 0.001 g f 0.012 m 0.001 gf 0.012 m 0.001 g f 0.006 m 0.002 g hk1005 1.00 m 0.05 0.5 m 0.05 0.5 m 0.05 0.25 m 0.10 f 0402 g f 0.039 m 0.002 g f 0.020 m 0.002 gf 0.020 m 0.002 g f 0.010 m 0.004 g hk1608 1.6 m 0.15 0.8 m 0.15 0.8 m 0.15 0.3 m 0.2 f 0603 g f 0.063 m 0.006 gf 0.031 m 0.006 g f 0.031 m 0.006 g f 0.012 m 0.008 g hk2125 2.0 yy 1.25 m 0.2 0.85 m 0.2 0.5 m 0.3 f 0805 g 1.0 yy f 0.079 yyy g f 0.049 m 0.008 g f 0.033 m 0.008 g f 0.020 m 0.012 g f 0.039 yyy g j 0.3 k 0.1 j 0.012 k 0.004 j 0.008 k 0.012 j 0.2 k 0.3 5zqf ?;9s c??? 3bohf joevdubodf y <o)> <o)> /? /? /? /? /? /? /? /? /? /? / / / / / / / / / / / / / / 3 *nby <n"> ), ), ), ), ?;9s c??? /? /? /? /? /? /? /? /? /? /? / / / / / / / / / / / / / / 3 3 3 3 3 3 3 3 3 ?;9s c? ???? /? /? /? /? /? /? /? /? /? /? / / / / / / / / / / / / / / 3 3 3 3 3 3 *nby <n"> *nby <n"> ?;9s c??? /4 /4 /4 /4 /4 /4 /4 /4 /+ /+ /+ /+ /+ /+ /+ /+ /+ /+ /+ /+ /+ /+ 3+ 3+ 3+ 3+ 3+ 3+ 3+ 3+ 3+ *nby <n"> *nby <n"> inductance imax [ ma ] rdcmax [ e ] imax [ ma ] rdcmax [ e ] imax [ ma ] rdcmax [ e ] imax [ ma ] rdcmax [ e ] 1.5nh 230 0.18 300 850 0.1 300 0.1 300 0.1 10.0nh 150 0.63 300 340 0.31 300 0.26 300 0.3 100.0nh 40 4.0 150 200 1.5 300 1 300 0.9 ey y? examples 55 ? +125 ? 55 ? +85 ? t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ? 222 ??aay part numbers t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ?: measuring frequency [ mhz ] ?????? inductance h nh i ordering code 100 300 500 800 1000 q f typical g *t
: frequency [ mhz ] ~? *t
: self-resonant frequency [ mhz ] min. typ. max. hk0603 0.30 m 0.03 f 0.012 m 0.001 g rohs 1.0 m 0.3nh t 4 100 6 12 17 22 27 10000 x 13000 0.14 0.088 250 rohs 1.2 m 0.3nh t 4 100 6 12 16 21 25 10000 x 13000 0.14 0.089 250 rohs 1.5 m 0.3nh t 4 100 6 12 15 20 23 10000 x 13000 0.18 0.11 230 rohs 1.8 m 0.3nh t 4 100 6 12 15 20 23 10000 x 13000 0.19 0.12 200 rohs 2.0 m 0.3nh t 4 100 6 12 15 20 22 10000 x 13000 0.20 0.13 200 rohs 2.2 m 0.3nh t 4 100 6 12 15 20 22 8800 12500 0.22 0.14 200 rohs 2.4 m 0.3nh t 4 100 6 12 15 20 22 8300 11700 0.24 0.15 200 rohs 2.7 m 0.3nh t 5 100 7 12 15 20 22 7700 11000 0.25 0.16 200 rohs 3.0 m 0.3nh t 5 100 7 12 15 20 22 7200 11000 0.28 0.18 180 rohs 3.3 m 0.3nh t 5 100 7 12 15 20 22 6700 9600 0.30 0.19 180 rohs 3.6 m 0.3nh t 5 100 7 12 15 20 22 6400 9100 0.30 0.20 170 rohs 3.9 m 0.3nh t 5 100 7 12 15 20 22 6000 8600 0.30 0.20 170 rohs 4.3 m 0.3nh t 5 100 7 12 15 19 21 5700 8100 0.40 0.22 150 rohs 4.7 m 0.3nh t 5 100 7 12 15 19 21 5300 7600 0.40 0.24 150 rohs 5.1 m 0.3nh t 5 100 7 12 15 19 21 5000 7100 0.40 0.26 150 rohs 5.6 m 0.3nh t 5 100 7 12 15 19 21 4600 6600 0.40 0.27 150 rohs 6.2 m 0.3nh t 5 100 7 11 14 18 20 4200 6100 0.44 0.29 150 rohs 6.8 m 5% t 5 100 7 11 14 18 20 3900 5600 0.48 0.30 150 rohs 7.5 m 5% t 5 100 7 11 14 18 19 3600 5300 0.53 0.34 150 rohs 8.2 m 5% t 5 100 7 11 14 18 19 3400 4900 0.55 0.34 150 rohs 9.1 m 5% t 5 100 7 11 14 17 18 3200 4600 0.62 0.40 150 rohs 10 m 5% t 5 100 7 11 14 17 18 2900 4200 0.63 0.41 150 rohs 12 m 5% t 5 100 7 11 14 17 18 2700 3800 0.7 0.45 100 rohs 15 m 5% t 5 100 7 11 13 16 17 2300 3300 0.8 0.5 100 rohs 18 m 5% t 5 100 7 11 13 16 17 2100 3000 0.9 0.57 100 rohs 22 m 5% t 5 100 7 11 13 15 16 1800 2600 1.2 0.71 100 rohs 27 m 5% t 4 100 6 10 12 14 15 1800 2600 1.8 1.11 50 rohs 33 m 5% t 4 100 6 10 12 14 14 1700 2400 2.1 1.33 50 rohs 39 m 5% t 4 100 6 10 12 13 12 1500 2100 2.4 1.51 50 rohs 47 m 5% t 4 100 6 10 11 12 11 1300 1800 2.8 1.74 50 rohs 56 m 5% t 4 100 6 10 11 11 10 1100 1600 3.0 1.85 50 rohs 68 m 5% t 4 100 6 10 11 11 10 1100 1500 3.0 2.30 50 rohs 82 m 5% t 4 100 6 10 11 10 8 1000 1400 3.5 2.60 50 rohs 100 m 5% t 4 100 6 9 10 9 6 900 1200 4.0 3.00 40 hk 0603 1n0 g hk 0603 1n2 g hk 0603 1n5 g hk 0603 1n8 g hk 0603 2n0 g hk 0603 2n2 g hk 0603 2n4 g hk 0603 2n7 g hk 0603 3n0 g hk 0603 3n3 g hk 0603 3n6 g hk 0603 3n9 g hk 0603 4n3 g hk 0603 4n7 g hk 0603 5n1 g hk 0603 5n6 g hk 0603 6n2 z hk 0603 6n8 z hk 0603 7n5 z hk 0603 8n2 z hk 0603 9n1 z hk 0603 10n z hk 0603 12n z hk 0603 15n z hk 0603 18n z hk 0603 22n z hk 0603 27n z hk 0603 33n z hk 0603 39n z hk 0603 47n z hk 0603 56n z hk 0603 68n z hk 0603 82n z hk 0603 r10 z t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ?: measuring frequency [ mhz ] ?????? inductance h nh i ordering code 100 300 500 800 1000 q f typical g *t
: frequency [ mhz ] ~? *t
: self-resonant frequency [ mhz ] min. typ. hk1005 hk 1005 1n0 g hk 1005 1n2 g hk 1005 1n5 g hk 1005 1n8 g hk 1005 2n0 g hk 1005 2n2 g hk 1005 2n4 g hk 1005 2n7 g hk 1005 3n0 g hk 1005 3n3 g hk 1005 3n6 g hk 1005 3n9 g hk 1005 4n3 g hk 1005 4n7 g hk 1005 5n1 g hk 1005 5n6 g hk 1005 6n2 g hk 1005 6n8 z hk 1005 7n5 z hk 1005 8n2 z hk 1005 9n1 z hk 1005 10n z hk 1005 12n z hk 1005 15n z hk 1005 18n z hk 1005 22n z hk 1005 27n z hk 1005 33n z hk 1005 39n z hk 1005 47n z hk 1005 56n z hk 1005 68n z hk 1005 82n z hk 1005 r10 z hk 1005 r12 z hk 1005 r15 z hk 1005 r18 z hk 1005 r22 z hk 1005 r27 z 1.0 m 0.3nh t 1.2 m 0.3nh t 1.5 m 0.3nh t 1.8 m 0.3nh t 2.0 m 0.3nh t 2.2 m 0.3nh t 2.4 m 0.3nh t 2.7 m 0.3nh t 3.0 m 0.3nh t 3.3 m 0.3nh t 3.6 m 0.3nh t 3.9 m 0.3nh t 4.3 m 0.3nh t 4.7 m 0.3nh t 5.1 m 0.3nh t 5.6 m 0.3nh t 6.2 m 0.3nh t 6.8 m 5% t 7.5 m 5% t 8.2 m 5% t 9.1 m 5% t 10 m 5% t 12 m 5% t 15 m 5% t 18 m 5% t 22 m 5% t 27 m 5% t 33 m 5% t 39 m 5% t 47 m 5% t 56 m 5% t 68 m 5% t 82 m 5% t 100 m 5% t 120 m 5% t 150 m 5% t 180 m 5% t 220 m 5% t 270 m 5% t 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 11 11 11 11 11 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 11 11 11 11 11 11 11 11 11 11 10 10 10 12 12 12 12 25 25 24 23 21 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 17 17 16 16 16 16 15 14 14 12 17 16 16 14 34 35 33 30 27 25 24 24 24 24 24 24 24 24 24 24 24 23 23 23 23 23 23 23 23 22 21 20 20 19 18 17 16 14 10 17 k k k 43 44 44 36 34 31 31 31 31 31 31 31 31 31 31 30 30 29 29 29 29 29 29 28 28 26 25 23 23 21 18 18 15 12 k k k k k 52 52 48 42 39 36 35 34 35 35 35 35 35 34 34 35 34 32 32 31 31 31 31 30 30 27 26 22 21 18 16 11 6 k k k k k k 10000 10000 6000 6000 6000 6000 6000 6000 6000 6000 5000 4000 4000 4000 4000 4000 3900 3900 3700 3600 3400 3200 2700 2300 2100 1900 1600 1300 1200 1000 750 750 600 600 600 550 500 450 400 x 13000 x 13000 x 13000 11000 10500 10000 9500 9000 8500 8000 7500 7000 6500 6000 5800 5700 5600 5500 5200 4900 4500 4300 3900 3500 3100 2800 2300 1900 1700 1500 1300 1200 1100 1000 800 920 810 700 600 0.08 0.09 0.1 0.12 0.12 0.13 0.13 0.13 0.16 0.16 0.2 0.21 0.2 0.21 0.21 0.23 0.25 0.25 0.25 0.28 0.3 0.31 0.4 0.46 0.55 0.6 0.7 0.8 0.9 1 1 1.2 1.3 1.5 1.6 3.2 3.7 4.2 4.8 0.04 0.04 0.05 0.06 0.06 0.07 0.07 0.08 0.09 0.1 0.11 0.12 0.12 0.12 0.13 0.15 0.16 0.17 0.18 0.21 0.22 0.23 0.28 0.31 0.35 0.42 0.47 0.5 0.52 0.58 0.61 0.7 0.81 0.94 1.1 2.57 2.97 3.29 3.92 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 200 200 200 200 180 150 150 150 140 130 120 110 900 900 850 700 700 700 650 650 600 550 500 500 500 500 450 430 430 430 400 380 360 340 330 320 310 300 300 250 250 230 220 200 200 200 200 200 200 200 200 k 55 ? j 125 c k 55 ? j 85 c 0.50 m 0.05 f 0.020 m 0.002 g t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ? ferrite products 5 223 rohs 1.0 m 0.3nh t 8 100 14 30 40 70 90 10000 x 13000 0.05 0.015 300 rohs 1.2 m 0.3nh t 8 100 14 30 40 70 90 10000 x 13000 0.05 0.015 300 rohs 1.5 m 0.3nh t 8 100 14 26 34 47 50 6000 x 13000 0.10 0.03 300 rohs 1.8 m 0.3nh t 8 100 10 18 24 30 34 6000 x 13000 0.10 0.06 300 rohs 2.2 m 0.3nh t 8 100 12 22 29 37 40 6000 12000 0.10 0.06 300 rohs 2.7 m 0.3nh t 10 100 13 24 32 41 45 6000 11000 0.10 0.06 300 rohs 3.3 m 0.3nh t 10 100 14 25 33 42 47 6000 9000 0.12 0.06 300 rohs 3.9 m 0.3nh t 10 100 13 25 33 42 46 6000 8000 0.14 0.07 300 rohs 4.7 m 0.3nh t 10 100 13 25 33 42 47 4000 6500 0.16 0.08 300 rohs 5.6 m 0.3nh t 10 100 14 25 33 42 46 4000 5800 0.18 0.09 300 rohs 6.8 m 5 l t 10 100 14 25 33 43 47 4000 5600 0.22 0.11 300 rohs 8.2 m 5 l t 10 100 14 26 34 44 48 3500 5200 0.24 0.13 300 rohs 10 m 5 l t 12 100 14 26 34 43 47 3400 4600 0.26 0.16 300 rohs 12 m 5 l t 12 100 14 27 35 45 49 2600 4000 0.28 0.17 300 rohs 15 m 5 l t 12 100 15 28 37 46 51 2300 3400 0.32 0.20 300 rohs 18 m 5 l t 12 100 15 27 36 44 48 2000 3000 0.35 0.21 300 0.8 m 0.15 rohs 22 m 5 l t 12 100 16 28 36 44 47 1600 2900 0.40 0.25 300 f 0.031 m 0.006 g rohs 27 m 5 l t 12 100 16 29 37 45 46 1400 2200 0.45 0.28 300 rohs 33 m 5 l t 12 100 17 31 40 46 47 1200 1800 0.55 0.35 300 rohs 39 m 5 l t 12 100 18 31 39 44 44 1100 1600 0.60 0.38 300 rohs 47 m 5 l t 12 100 17 28 34 35 34 900 1600 0.70 0.45 300 rohs 56 m 5 l t 12 100 17 28 34 34 31 900 1400 0.75 0.50 300 rohs 68 m 5 l t 12 100 18 29 34 30 22 700 1200 0.85 0.55 300 rohs 82 m 5 l t 12 100 18 28 33 27 600 1100 0.95 0.60 300 rohs 100 m 5 l t 12 100 18 27 28 16 600 1000 1.00 0.65 300 rohs 120 m 5 l t 8 50 16 24 23 500 800 1.20 0.68 300 rohs 150 m 5 l t 8 50 13 19 16 500 800 1.20 0.73 300 rohs 180 m 5 l t 8 50 13 18 12 400 700 1.30 0.85 300 rohs 220 m 5 l t 8 50 12 16 400 600 1.50 0.95 300 rohs 270 m 5 l t 8 50 14 15 400 550 1.9 1.34 150 rohs 330 m 5 l t 8 50 14 350 480 2.1 1.53 150 rohs 390 m 5 l t 8 50 13 350 410 2.3 1.72 150 rohs 470 m 5 l t 8 50 13 300 360 2.6 2.04 150 q min. v ? dc.resistance hei max. typ. ^ thickness h mm i f inch g ?v rated current h ma i lq *t
: measuring frequency [ mhz ] ?????? inductance h nh i ordering code 100 300 500 800 1000 q f typical g *t
: frequency [ mhz ] max. hk1608 ~? *t
: self-resonant frequency [ mhz ] min. typ. rohs 1.5 m 0.3nh 10 100 21 39 57 61 68 4000 x 6000 0.10 0.02 300 rohs 1.8 m 0.3nh 10 100 18 35 49 55 59 4000 x 6000 0.10 0.02 300 rohs 2.2 m 0.3nh 10 100 18 33 46 53 58 4000 x 6000 0.10 0.03 300 rohs 2.7 m 0.3nh 12 100 19 36 50 56 60 4000 x 6000 0.10 0.03 300 rohs 3.3 m 0.3nh 12 100 16 29 40 47 51 4000 x 6000 0.13 0.04 300 rohs 3.9 m 0.3nh 12 100 18 33 46 54 60 4000 x 6000 0.15 0.05 300 rohs 4.7 m 0.3nh 12 100 18 34 46 55 60 3500 x 6000 0.20 0.05 300 rohs 5.6 m 0.3nh 15 100 20 38 51 60 66 3200 5400 0.23 0.05 300 rohs 6.8 m 5 l 15 100 20 39 52 63 69 2800 4200 0.25 0.06 300 0.85 m 0.2 rohs 8.2 m 5 l 15 100 21 40 54 63 70 2400 3700 0.28 0.07 300 f 0.033 m 0.008 g rohs 10 m 5 l 15 100 20 38 51 60 67 2100 3100 0.30 0.09 300 rohs 12 m 5 l 15 100 21 39 52 60 67 1900 3000 0.35 0.10 300 rohs 15 m 5 l 15 100 22 42 55 63 72 1600 2600 0.40 0.11 300 rohs 18 m 5 l 15 100 24 44 57 63 72 1500 2300 0.45 0.13 300 rohs 22 m 5 l 18 100 23 43 55 60 69 1400 2100 0.50 0.16 300 rohs 27 m 5 l 18 100 23 42 53 58 68 1300 1800 0.55 0.17 300 rohs 33 m 5 l 18 100 24 43 54 55 60 1200 1700 0.60 0.19 300 rohs 39 m 5 l 18 100 23 41 50 47 47 1000 1400 0.65 0.25 300 rohs 47 m 5 l 18 100 23 41 49 43 41 900 1200 0.70 0.26 300 rohs 56 m 5 l 18 100 23 42 48 39 38 800 1100 0.75 0.28 300 rohs 68 m 5 l 18 100 25 42 45 30 700 900 0.80 0.33 300 rohs 82 m 5 l 18 100 24 41 41 600 800 0.90 0.37 300 rohs 100 m 5 l 18 100 23 37 37 600 800 0.90 0.40 300 rohs 120 m 5 l 13 50 22 33 29 500 700 0.95 0.43 300 rohs 150 m 5 l 13 50 22 34 26 500 700 1.00 0.46 300 0.039 j 0.008 rohs 180 m 5 l 13 50 23 34 20 400 600 1.10 0.50 300 yy k 0.012 rohs 220 m 5 l 12 50 20 23 350 550 1.20 0.75 300 rohs 270 m 5 l 12 50 20 19 300 480 1.30 0.85 300 rohs 330 m 5 l 12 50 22 15 250 400 1.40 0.90 300 rohs 390 m 5 l 10 50 17 12 250 400 1.30 0.85 300 rohs 470 m 5 l 10 50 17 200 350 1.50 0.95 300 ??aay part numbers hk2125 q min. v ? dc-resistance hei max. typ. ?v rated current h ma i lq *t
: measuring frequency [ mhz ] ?????? inductance h nh i ordering code 100 300 500 800 1000 ^ thickness h mm i f inch g q typical *t
: frequency [ mhz ] ~? *t
: self-resonant frequency [ mhz ] min. y typ. j 0.2 k 0.3 1.00 f yy g hk 1608 1n0 g hk 1608 1n2 g hk 1608 1n5 g hk 1608 1n8 g hk 1608 2n2 g hk 1608 2n7 g hk 1608 3n3 g hk 1608 3n9 g hk 1608 4n7 g hk 1608 5n6 g hk 1608 6n8 z hk 1608 8n2 z hk 1608 10n z hk 1608 12n z hk 1608 15n z hk 1608 18n z hk 1608 22n z hk 1608 27n z hk 1608 33n z hk 1608 39n z hk 1608 47n z hk 1608 56n z hk 1608 68n z hk 1608 82n z hk 1608 r1 0 z hk 1608 r1 2 z hk 1608 r1 5 z hk 1608 r1 8 z hk 1608 r2 2 z hk 1608 r2 7 z hk 1608 r3 3 z hk 1608 r3 9 z hk 1608 r4 7 z hk 2125 1n5s hk 2125 1n8s hk 2125 2n2s hk 2125 2n7s hk 2125 3n3s hk 2125 3n9s hk 2125 4n7s hk 2125 5n6s hk 2125 6n8j hk 2125 8n2j hk 2125 10nj hk 2125 12nj hk 2125 15nj hk 2125 18nj hk 2125 22nj hk 2125 27nj hk 2125 33nj hk 2125 39nj hk 2125 47nj hk 2125 56nj hk 2125 68nj hk 2125 82nj hk 2125 r10j hk 2125 r12j hk 2125 r15j hk 2125 r18j hk 2125 r22j hk 2125 r27j hk 2125 r33j hk 2125 r39j hk 2125 r47j t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ? 224 ?
q
$y electrical characteristics q- *t
:?
q?y q-characteristics f measured by hp8719c g ??e??? *t
:?
q?y impedance-vs-frequency characteristics f measured by hp8719c g ?????? *t
:?
q?y inductance-vs-frequency characteristics f measured by hp8719c g hk0603 hk0603 hk0603 10 10 10 2 4 6 10 0 0.01 0.1 1 10 0.01 0.01 0.1 1 10 0.1 1 10 6.8nh 10nh 47nh 22nh 47nh 22nh 10nh 6.8nh 47nh 22nh 10nh 6.8nh
226 ?
goy external dimensions ?t??3??y available inductance range unit d mm f inch g type l w t e hkq0603 0.6 m 0.03 0.3 m 0.03 0.3 m 0.03 0.15 m 0.05 f 0201 g f 0.024 m 0.001 g f 0.012 m 0.001 gf 0.012 m 0.001 g f 0.006 m 0.002 g 5zqf ?;9s c??? 3bohf joevdubodf y <o)> <o)> /? /? /? /? /? /? /? /? /? /? / / / *nby <n"> ),2 t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ?: measuring frequency [ mhz ] ?????? inductance h nh i ordering code 100 300 500 800 1000 q f typical g *t
: frequency [ mhz ] ~? *t
: self-resonant frequency [ mhz ] min. typ. max. hkq0603 0.30 m 0.03 f 0.012 m 0.001 g hkq 0603 1n0 g hkq 0603 1n2 g hkq 0603 1n5 g hkq 0603 1n8 g hkq 0603 2n2 g hkq 0603 2n7 g hkq 0603 3n3 g hkq 0603 3n9 g hkq 0603 4n7 g hkq 0603 5n6 g hkq 0603 6n8 z hkq 0603 8n2 z hkq 0603 10n z ??aay part numbers t w g z z tx???????0)g?u???b{ ? 0.3nh fgg z ? 5 ? fzg ? ferrite products 5 227 ?
q
$y electrical characteristics q- *t
:?
q?y q-characteristics f measured by hp8719c g ??e??? *t
:?
q?y impedance-vs-frequency characteristics f measured by hp8719c g ?????? *t
:?
q?y inductance-vs-frequency characteristics f measured by hp8719c g hkq0603 hkq0603 hkq0603 50 45 40 35 30 25 20 15 10 5 0 0.01 0.1 1 10 0.01 0.01 0.1 1 10 0.1 1 10 10nh 2.2nh 2.2nh 10nh 10 10 2 4 10 0 2.2nh 10nh
ay packaging 258 ck 1608 ck 2125 lk 1005 lk 1608 lk 2125 hkq 0 6 0 3 hk 0603 hk 1005 hk 1608 bk 0603 bk 1005 bk 1608 bk 2125 bk 2010 bkp 1 0 0 5 bkp 1 6 0 8 bkp 2 1 2 5 ck1608 f 0603 g 0.8 4000 e f 0.031 g 0.85 4000 e ck2125 f 0805 g f 0.033 g 1.25 e 2000 f 0.049 g ckp3216 f 1206 g 0.8 e 4000 f 0.031 g lk1005 f 0402 g 0.5 10000 e f 0.020 g lk1608 f 0603 g 0.8 4000 e f 0.031 g 0.85 4000 e lk2125 f 0805 g f 0.033 g 1.25 e 2000 f 0.049 g hkq0603 f 0201 g 0.3 15000 e f 0.012 g hk0603 f 0201 g 0.3 15000 e f 0.012 g hk1005 f 0402 g 0.5 10000 e f 0.020 g hk1608 f 0603 g 0.8 4000 e f 0.031 g 0.85 e 4000 hk2125 f 0805 g f 0.033 g 1.0 e 3000 f 0.039 g bk0603 f 0201 g 0.3 15000 e f 0.012 g bk1005 f 0402 g 0.5 10000 e f 0.020 g bk1608 f 0603 g 0.8 4000 e f 0.031 g 0.85 4000 e bk2125 f 0805 g f 0.033 g 1.25 e 2000 f 0.049 g bk2010 f 0804 g 0.45 4000 e f 0.018 g bk3216 f 1206 g 0.8 e 4000 f 0.031 g bkp1005 f 0402 g 0.5 1 0000 e f 0.020 g bkp1608 f 0603 g 0.8 4000 e f 0.031 g bkp2125 f 0805 g 0.85 4000 e f 0.033 g 2125 3216 2125 2125 2125 3216 2 a?e??py taping material 1 7 ? !?o?
: minimum quantity f a?e??ay tape & reel packaging a j
:? [ pcs ] standard quantity a? ??a? paper tape embossed tape yy type
a ?? thickness [ mm ] f inch g ck ckp lk hk bk bk
ay packaging ferrite products 5 259 ck2125 f 0805 g 1.25 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 2.0 0.3 f 0.049 g f 0.059 m 0.008 gf 0.091 m 0.008 gf 0.157 m 0.004 g f 0.079 gf 0.012 g ckp3216 f 1206 g 0.8 1.9 m 0.1 3.5 m 0.1 4.0 m 0.1 1.4 0.3 f 0.031 g f 0.075 m 0.004 gf 0.138 m 0.004 gf 0.157 m 0.004 g f 0.055 gf 0.012 g lk2125 f 0805 g 1.25 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 2.0 0.3 f 0.049 g f 0.059 m 0.008 gf 0.091 m 0.008 gf 0.157 m 0.004 g f 0.079 gf 0.012 g 0.85 1.5 hk2125 f 0805 g f 0.033 g 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 f 0.059 g 0.3 1.0 f 0.059 m 0.008 g f 0.091 m 0.008 g f 0.157 m 0.004 g 2.0 f 0.012 g f 0.039 g f 0.079 g bk2125 f 0805 g 1.25 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 2.0 0.3 f 0.049 g f 0.059 m 0.008 g f 0.091 m 0.008 g f 0.157 m 0.004 g f 0.079 gf 0.012 g bk3216 f 1206 g 0.8 1.9 m 0.1 3.5 m 0.1 4.0 m 0.1 1.4 0.3 f 0.031 g f 0.075 m 0.004 g f 0.138 m 0.004 g f 0.157 m 0.004 g f 0.055 g f 0.012 g y a? 8mm ? 4 ???? ?~ ? leader and blank portion 5 ???
go reel size 3 a?e??
goy taping dimensions paper tape (0.315 inches wide) 2.0 m 0.5 f 0.079 m 0.031 g b 13.0 m 0.2 fb 0.512 m 0.020 g 6 ??a?sy top tape strength ??a?w #m?xz<
$1m2to 0.1 ? 0.7n qs??b{ the top tape requires a peel-off force of 0.1 v 0.7n in the direction of the arrow as illustrated below. unit : mm (inch) unit : mm (inch) 160mm ? f 6.3inches or more g ?v z`m2 direction of tape feed 100mm ? f 3.94inches or more g 400mm ? f 15.7inches or more g a?? max. tape thickness kt
?e?? insertion pitch f yy type ??
? ? chip cavity ab
a ?? thickness h mm i y ??a? 8mm ? embossed tape (0.312 inches wide)
a ?? ??
? ?
?e?? a?? thickness chip cavity insertion pitch tape thickness h mm i abft ck1608 f 0603 g 0.8 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max f 0.031 gf 0.039 m 0.008 gf 0.071 m 0.008 g f 0.157 m 0.004 g f 0.043max g ck2125 f 0805 g 0.85 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 1.1max f 0.033 gf 0.059 m 0.008 gf 0.091 m 0.008 g f 0.157 m 0.004 g f 0.043max g lk1005 f 0402 g 0.5 0.65 m 0.1 1.15 m 0.1 2.0 m 0.05 0.8max f 0.020 gf 0.026 m 0.004 gf 0.045 m 0.004 g f 0.079 m 0.002 g f 0.031max g lk1608 f 0603 g 0.8 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max f 0.031 gf 0.039 m 0.008 gf 0.071 m 0.008 gf 0.157 m 0.004 g f 0.043max g lk2125 f 0805 g 0.85 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 1.1max f 0.033 gf 0.059 m 0.008 gf 0.091 m 0.008 g f 0.157 m 0.004 g f 0.043max g hkq0603(0201) 0.3 0.40 m 0.06 0.70 m 0.06 2.0 m 0.05 0.45max f 0.012 gf 0.016 m 0.002 gf 0.028 m 0.002 g f 0.079 m 0.002 gf 0.018max g hk0603(0201) 0.3 0.40 m 0.06 0.70 m 0.06 2.0 m 0.05 0.45max f 0.012 gf 0.016 m 0.002 gf 0.028 m 0.002 g f 0.079 m 0.002 gf 0.018max g hk1005 f 0402 g 0.5 0.65 m 0.1 1.15 m 0.1 2.0 m 0.05 0.8max f 0.020 gf 0.026 m 0.004 gf 0.045 m 0.004 g f 0.079 m 0.002 g f 0.031max g hk1608 f 0603 g 0.8 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max f 0.031 gf 0.039 m 0.008 gf 0.071 m 0.008 gf 0.157 m 0.004 g f 0.043max g bk0603 f 0201 g 0.3 0.40 m 0.06 0.70 m 0.06 2.0 m 0.05 0.45max f 0.012 gf 0.016 m 0.002 gf 0.028 m 0.002 g f 0.079 m 0.002 gf 0.018max g bk1005 f 0402 g 0.5 0.65 m 0.1 1.15 m 0.1 2.0 m 0.05 0.8max f 0.020 gf 0.026 m 0.004 gf 0.045 m 0.004 gf 0.079 m 0.002 gf 0.031max g bk1608 f 0603 g 0.8 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max f 0.031 gf 0.039 m 0.008 gf 0.071 m 0.008 g f 0.157 m 0.004 g f 0.043max g bk2125 f 0805 g 0.85 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 1.1max f 0.033 gf 0.059 m 0.008 gf 0.091 m 0.008 g f 0.157 m 0.004 g f 0.043max g bk2010 f 0804 g 0.45 1.2 m 0.1 2.17 m 0.1 4.0 m 0.1 0.80max f 0.018 gf 0.047 m 0.004 g f 0.085 m 0.004 g f 0.157 m 0.004 g f 0.031max g bkp1005 f 0402 g 0.5 0.65 m 0.1 1.15 m 0.1 2.0 m 0.05 0.8max f 0.020 gf 0.026 m 0.004 gf 0.045 m 0.004 gf 0.079 m 0.002 gf 0.031max g bkp1608 f 0603 g 0.8 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max f 0.031 gf 0.039 m 0.008 g f 0.071 m 0.008 g f 0.157 m 0.004 g f 0.043max g bkp2125 f 0805 g 0.85 1.5 m 0.2 2.3 m 0.2 4.0 m 0.1 1.1max f 0.033 gf 0.059 m 0.008 g f 0.091 m 0.008 g f 0.157 m 0.004 g f 0.043max g yy type
ferrite products 5 261 reliability data 1/4 multilayer chip inductors and beads * definition of rated current : in the ck and bk series, the rated current is the value of current at which the temperature of the element is increased within 20 c . in the bk series p type and ck series p type, the rated current is the value of current at which the temperature of the element is increased within 40 c . in the lk and hk series, the rated current is either the dc value at which the internal l value is decreased within 5% with the application of dc bias, or the value of current at which the temperature of the element is increased within 20 c . 5.inductance bkp1608 bkp1005 ckp3216 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 100 v 500ma dc 10 v 600 e m 25 l 150 v 1000ma dc 10 v 1000 e m 25 l 150 v 1500ma dc 22 v 2500 e m 25 l 200 v 1200ma dc 15 v 2500 e m 25 l 100ma dc 5 v 600 e m 25 l 100 v 200ma dc 68 v 1000 e m 25 l 1.0a dc 120 e m 25 l 1.0 v 3.0a dc 33 v 390 e m 25 l 2.0 v 4.0a dc 60 v 500ma dc 0.1 v 10.0 a h d m 20 l 1.0 v 4.7 a h d m 20 l at dc 200ma 0.4 v 1.8 a h min. 0.12 v 2.2 a h d m 10 l 0.047 v 33.0 a h d m 20 l 0.10 v 12.0 a h d m 10 l 0.047 v 33.0 a h d m 20 l 0.10 v 12.0 a h d m 10 l 1.0 v 6.2nh d m 0.3nh 6.8 v 100nh d m 5 l 1.0 v 6.2nh d m 0.3nh 6.8 v 270nh d m 5 l 1.0 v 5.6nh d m 0.3nh 6.8 v 470nh d m 5 l 1.0 v 5.6nh d m 0.3nh 6.8 v 470nh d m 5 l 0.7 v 1.1a dc 10 v 25ma dc 1 v 50ma dc 5 v 300ma dc 40 v 250ma dc 110 v 300ma dc 150 v 300ma dc 300ma dc 33 v 220 e m 25 l bb k 55 vj 125 c k 55 vj 125 c bk2010 hk2125 hk1608 k 55 vj 85 c k 55 vj 85 c ck2125 lk1005 hk0603 hk1005 k 40 vj 85 c k 40 vj 85 c k 40 vj 85 c k 40 vj 85 ck 55 vj 125 c k 55 vj 125 c bkp2125 lk2125 bb bb bb bb bb bb 40 v 100ma dc 2.2 v 10.0 a h d m 20 l 1.0 v 5.6nh d m 0.3nh 6.8 v 10nh d m 5 l 150 v 400ma dc ck1608 hkq0603 bb bb bb bb bb item 1.operating temperature range 2.storage tem- perature range 3.rated current 4.impedance specified value array test methods and remarks bk0603 series: measuring frequency: 100 m 1mhz measuring equipment: hp4291a measuring jig: 16193a bk1005 series: bkp1005 series: measuring frequency: 100 m 1mhz measuring equipment: hp4291a measuring jig: 16192a, 16193a bk1608, 2125 series: bkp1608, 2125 series: measuring frequency: 100 m 1mhz measuring equipment: hp4291a, hp4195a measuring jig: 16092a or 16192a (hw) bk2010, 3216 series: measuring frequency: 100 m 1mhz measuring equipment: hp4291a, hp4195a measuring jig: 16192a ck series: measuring frequency: 2 to 4mhz (ck1608) measuring frequency: 2 to 25mhz (ck2125) measuring frequency: 1mhz (ckp3216) lk series: measuring frequency: 10 to 25mhz (lk1005) measuring frequency: 1 to 50mhz (lk1608) measuring frequency: 0.4 to 50mhz (lk2125) measuring equipment, jig: hp4194 j 16085b j 16092a (or its equivalent) hp4195 j 41951 j 16092a (or its equivalent) hp4294 j 16192a hp4291a j 16193a (lk1005) hp4285a j 42841a j 42842c j 42851-61100 (ckp3216) measuring current: 1ma rms (0.047 to 4.7 a h) 0.1ma rms (5.6 to 33 a h) hk series: measuring frequency: 100mhz (hkq0603,hk0603, hk1005) measuring frequency: 50/100mhz (hk1608, hk2125) measuring equipment, jig: hp4291a j 16197a (hkq0603,hk0603) hp4291a j 16193a (hk1005) hp4291a (or its equivalent) j 16092a j in-house made jig (hk1608, 2125)
ferrite products 5 263 reliability data 2/4 multilayer chip inductors and beads bkp1608 bkp1005 ckp3216 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 hk2125 hk1608 ck2125 lk1005 hk0603 hk1005 bkp2125 lk2125 10 v 20 min. 15 v 20 min. 10 v 35 min. 15 v 50 min. 4 v 5 min. 8 v 12 min. 10 v 18 min. 8min. bb bb 0.05 v 0.80 e max. 0.075 v 1.50 e max. 0.05 v 1.10 e max. 0.05 v 0.75 e max. 0.10 v 0.90 e max. 0.15 v 0.80 e max. 0.025 v 0.140 e max. 0.140 e max. 0.020 v 0.050 e max. 0.16 v 0.65 e max. 24 v 235mhz min. 40 v 180mhz min. 9 v 260mhz min. 13 v 320mhz min. 900 v 10000mhz min. 400 v 10000mhz min. 300 v 10000mhz min. 200 v 4000mhz min. 0.11 v 0.20 e max. bb bb bb bb 0.7 v 1.70 e max. 0.3 v 2.95 e max. 0.20 v 1.25 e max. 0.14 v 4.0 e max. ck1608 hkq0603 20 min. 4 v 5 min. 0.30 v 0.90 e ( m 30 l ) 17 v 33mhz min. 4000 v 10000mhz min. 0.10 v 0.83 e max. 0.08 v 4.8 e max. 0.10 v 1.5 e max. 0.05 v 2.6 e max. 6.q specified value item array test methods and remarks inductance change: within m 10% 7.dc resistance 8. self resonance frequency(srf) 9.temperature characteristic 10. resistance to flexure of substrate no mechanical damage. lk series: measuring frequency: 10 to 25 mhz (lk1005) ck series: measuring frequency: 2 to 4 mhz (ck1608) measuring frequency: 2 to 25 mhz (ck2125) measuring frequency: 1 to 50 mhz (lk1608) measuring frequency: 0.4 to 50mhz (lk2125) measuring equipment, jig: hp4194a + 16085b + 16092a hp4195a + 41951 + 16092a hp4294a + 16192a hp4291a + 16193a (lk1005) (or its equivalent) (or its equivalent) measuring current: 1ma rms (0.047 to 4.7 a h) 0.1ma rms (5.6 to 33 a h) hk series: measuring frequency: 100mhz (hkq0603,hk0603 , hk1005) measuring frequency: 50 / 100mhz (hk1608 , 2125) measuring equipment, jig: hp4291a + 16193a ( hk1005) hp4291a + 16197a ( hkq0603, hk0603) hp4195a + 16092a + in-house made jig measuring equipment: voac k 7412 (made by iwasaki tsushinki) voac k 7512 (made by iwasaki tsushinki) lk series: measuring equipment: hp4195a measuring jig: 41951 + 16092a (or its equivalent) hk series: measuring equipment: hp8719c y hp8753d f hk2125 g hk series: temperature range: -30 to +85 c reference temperature: +20 c warp: 2mm testing board: glass epoxy-resin substrate thickness: 0.8mm (hk1608, 2125)
ferrite products 5 265 reliability data 3/4 (note 1) when there are questions concerning mesurement result d measurement shall be made after 48 m 2 hrs of recovery under the standard condition. multilayer chip inductors and beads bkp1608 bkp1005 ckp3216 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 hk2125 hk1608 ck2125 ck1608 lk1005 hk0603 hkq0603 hk1005 bkp2125 lk2125 specified value item test methods and remarks at least 75% of terminal elec trode is covered by new solder. no mechanical damage. remaining terminal electrode: 70% min. inductance change r10 v 4r7: within m 10% 6r8 v 100: within m 15% ckp3216: within m 30% no mechanical damage. remaining terminal electrode: 70% min. inductance change 47n v 4r7: within m 10% 5r6 v 330: within m 15% no mechanical damage. remaining terminal electrode: 70% min. inductance change: within m 5% no mechanical damage. inductance change: within m 10% qchange: within m 30% no mechanical damage. inductance change: within m 10% qchange: within m 20% at least 75% of terminal electrode is covered by new solder. appearance: no significant abnormality impedance change: within m 30% appearance: no significant abnormality impedance change: within m 30% 11.solderability 12.resistance to soldering 13.thermal shock solder temperature: 230 m 5 c duration: 4 m 1 sec. solder temperature: 260 m 5 c duration: 10 m 0.5 sec. preheating temperature: 150 to 180 c preheating time: 3 min. recovery: 2 to 3 hrs of recovery under the stan- dard condition after the test. (see note 1) flux: immersion into methanol solution with colophony for 3 to 5 sec. conditions for 1 cycle step 1: minimum operating temperature j 0/ k 3 c 30 m 3 min. step 2: room temperature 2 to 3min. step 3: minimum operating temperature j 0/ k 3 c 30 m 3 min. step 4: room temperature 2 to 3min. number of cycles: 5 recovery: 2 to 3 hrs of recovery under the stan- dard condition after the test. (see note 1) no mechanical damage. inductance change: within m 20% qchange: within m 30% no mechanical damage. inductance change: within m 30% array
ferrite products 5 267 reliability data 4/4 multilayer chip inductors and beads note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20 m 2 c of temperature, 60 to 70% relative humidity, and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition." (note 1) measurement shall be made after 48 m 2 hrs of re- covery under the standard condition. bkp1608 bkp1005 ckp3216 lk1608 bk2125 bk3216 bk1005 bk0603 bk1608 bk2010 hk2125 hk1608 ck2125 ck1608 lk1005 hk0603 hkq0603 hk1005 bkp2125 lk2125 specified value item test methods and remarks array 14. damp heat f steady state g 15.loading under damp heat 16.loading at high temperature bk series: temperature: 40 m 2 c humidity: 90 to 95%rh duration: 500 hrs recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. f see note1 g f see note1 g f see note1 g lk, ck, hk series: temperature: 40 m 2 c (lk, ck series) 60 m 2 c (hk series) humidity: 90 to 95%rh duration: 500 m 12 hours recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. standard condition after the removal from test chamber. bk series: temperature: 40 m 2 c (lk series) humidity: 90 to 95%rh duration: 500 hrs applied current: rated current recovery: 2 to to 3 hrs of recovery under the f see note1 g standard condition after the removal from test chamber. 2 to 3 hrs of recovery under the f see note1 g standard condition after the removal from test chamber. 3 hrs of recovery under the lk, ck, hk series: temperature: 40 m 2 c (lk, ck series) 60 m 2 c (hk series) humidity: 90 to 95%rh duration: 500 m 12 hrs applied current: rated current recovery: 2 bk series: temperature: 125 m 3 c applied current: rated current duration: 500 hrs recovery: lk, ck, hk series, bk series p type: temperature: 85 m 2 c (lk, ck series) : 85 m 3 c (bk series p type) : 85 m 2 c (hk 1608, 2125) : 85 m 2 c (hk 1005 operating temperature range k 55 to j 85 c ) : 1 25 m 2 c (hkq 0603,hk 0603, hk1005) operating temperature range k 55 to j 125 c ) applied current: rated current duration: 500 m 12 hrs recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. +24 k 0 appearance: no significant abnormality impedance change: within m 30% appearance: no significant abnormality impedance change: within m 30% no mechanical damage, inductance change within m 30 l +24 k 0 +24 k 0 no mechanica damage. inductance change: within m 20% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 20% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: within m 30% no mechanica damage. inductance change: within m 20% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: 0.047 to 12.0 a h: within m 10% 15.0 to 33.0 a h: within m 15% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 20% no mechanica damage. inductance change: within m 30% no mechanica damage. inductance change: within m 20% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: 0.047 to 12.0 a h: within m 10% 15.0 to 33.0 a h: within m 15% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 30% no mechanica damage. inductance change: within m 10% q change: within m 20% no mechanica damage. inductance change: within m 30% f see note1 g
precautions ferrite products 5 269 1/7 precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s 1. circuit design s verification of operating environment, electrical rating and performance 1. a malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. as such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. s operating current (verification of rated current) 1. the operating current for inductors must always be lower than their rated values. 2. do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. technical considerations stages precautions 2. pcb design s pattern configurations (design of land-patterns) 1. when inductors are mounted on a pcb, the amount of solder used (size of fillet) can directly affect inductor performance. therefore, the following items must be carefully considered in the design of solder land pat- terns: (1) the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. therefore, when designing land-patterns it is necessary to consider the appropri- ate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by sol- der-resist. 1. the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts (larger fillets which extend above the component end terminations). examples of improper pattern designs are also shown. (1) recommended land dimensions for a typical chip inductor land patterns for pcbs type 0603 1005 1608 2125 3216 l 0.6 1.0 1.6 2.0 3.2 w 0.3 0.5 0.8 1.25 1.6 a 0.20 v 0.30 0.45 v 0.55 0.6 v 0.8 0.8 v 1.2 1.8 v 2.5 b 0.20 v 0.30 0.40 v 0.50 0.6 v 0.8 0.8 v 1.2 0.6 v 1.5 c 0.25 v 0.40 0.45 v 0.55 0.6 v 0.8 0.9 v 1.6 1.2 v 2.0 recommended land dimensions for reflow-soldering (unit: mm) type 1608 2125 3216 l 1.6 2.0 3.2 w 0.8 1.25 1.6 a0.8 v 1.0 1.0 v 1.4 1.8 v 2.5 b0.5 v 0.8 0.8 v 1.5 0.8 v 1.7 c0.6 v 0.8 0.9 v 1.2 1.2 v 1.6 size size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. recommended land dimensions for wave-soldering (unit: mm) recommended land dimension for reflow-soldering (unit: mm) 3216 2010 l3.2 2.0 w1.6 1.0 a 0.7 v 0.9 0.5 v 0.6 b 0.8 v 1.0 0.5 v 0.6 c 0.4 v 0.5 0.2 v 0.3 d0.80.5 4j[f
precautions ferrite products 5 271 (2) examples of good and bad solder application not recommended recommended 2.pcb design not recommended recommended deflection of the board mixed mounting of smd and leaded compo- nents component placement close to the chassis hand-soldering of leaded com- ponents near mounted compo- nents horizontal com- ponent place- ment s pattern configurations (inductor layout on panelized [breakaway] pc boards) 1. after inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes (pcb cutting, board inspec- tion, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) for this reason, planning pattern configurations and the position of smd inductors should be carefully per- formed to minimize stress. 1-1. the following are examples of good and bad inductor layout; smd inductors should be located to minimize any possible mechanical stresses from board warp or deflection. item 1-2. to layout the inductors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. an example below should be counted for better design. 1-3. when breaking pc boards along their perforations, the amount of mechani- cal stress on the inductors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd inductor layout must also consider the pcb splitting procedure. 2/7 stages precautions technical considerations precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s
precautions ferrite products 5 273 3/7 technical considerations stages precautions 1. if the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: (1)the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for deflection of the board. (2)the pick-up pressure should be adjusted between 1 and 3 n static loads. (3)to reduce the amount of deflection of the board caused by impact of the pick- up nozzle, supporting pins or back-up pins should be used under the pc board. the following diagrams show some typical examples of good pick-up nozzle placement: improper method proper method 2. as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. s selection of adhesives 1. mounting inductors with adhesives in preliminary as- sembly, before the soldering stage, may lead to de- graded inductor characteristics unless the following factors are appropriately checked; the size of land pat- terns, type of adhesive, amount applied, hardening tem- perature and hardening period. therefore, it is impera- tive to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1. some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect compo- nent placement, so the following precautions should be noted in the applica- tion of adhesives. (1)required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have sufficient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. 3.considerations for automatic placement s adjustment of mounting machine 1. excessive impact load should not be imposed on the inductors when mounting onto the pc boards. 2. the maintenance and inspection of the mounter should be conducted periodically. double-sided mounting single-sided mounting precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s
precautions ferrite products 5 275 3.considerations for automatic placement 4.soldering s selection of flux 1. since flux may have a significant effect on the perfor- mance of inductors, it is necessary to verify the follow- ing conditions prior to use; (1)flux used should be with less than or equal to 0.1 wt% (chlorine conversion method) of halogenated content. flux having a strong acidity content should not be ap- plied. (2)when soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. (3)when using water-soluble flux, special care should be taken to properly clean the boards. s soldering temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. 1-1. when too much halogenated substance (chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of resi- due after soldering may lead to corrosion of the terminal electrodes or deg- radation of insulation resistance on the surface of the inductor. 1-2. flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to minimize the amount of flux applied, it is recom- mended to use a flux-bubbling system. 1-3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water- soluble flux. 1-1. preheating when soldering heating: chip inductor components should be preheated to within 100 to 130 c of the soldering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 c . chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precaution 4/7 figure 0805 case sizes as examples a 0.3mm min b 100 v 120 a m c area with no adhesive when using adhesives to mount inductors on a pcb, inappropriate amounts of adhesive on the board may adversely affect component placement. too little adhesive may cause the inductors to fall off the board during the solder process. too much adhesive may cause defective soldering due excessive flow of adhe- sive on to the land or solder pad. [recommended conditions] precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s
precautions ferrite products 5 277 5/7 stages precautions technical considerations 4.soldering recommended conditions for soldering [reflow soldering] temperature profile 2. because excessive dwell times can detrimentally affect solderability, sol- dering duration should be kept as close to recommended times as pos- sible. [wave soldering] temperature profile caution 1. the ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below: caution 1. make sure the inductors are preheated sufficiently. 2. the temperature difference between the inductor and melted solder should not be greater than 100 to 130 c 3. cooling after soldering should be as gradual as possible. 4. wave soldering must not be applied to the inductors designated as for reflow soldering only. [hand soldering] temperature profile caution 1. use a 20w soldering iron with a maximum tip diameter of 1.0 mm. 2. the soldering iron should not directly touch the inductor. s cleaning conditions 1. when cleaning the pc board after the inductors are all mounted, select the appropriate cleaning solution ac- cording to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materi- als from the production process.) 1. the use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties (especially insulation resistance). 5.cleaning precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s s and please contact us about peak temperature when you use lead-free paste. peak 260 c max 10 sec max f pb free soldering g t ceramic chip components should be preheated to within 100 to 130 c of the soldering. t assured to be reflow soldering for 2 times. temperature fcg 300 200 100 0 preheating 150 c 60 sec min gradually cooling heating above 230 c 40 sec max f pb free soldering g peak 260 c max 10 sec max t ceramic chip components should be preheated to within 100 to 130 c of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. temperature fcg 300 200 100 0 gradually cooling preheating 150 c 120 sec min f pb free soldering g f t?) t 190 cf 3216type max g , ?) t 130 cf 3225 type min gg t it is recommended to use 20w soldering iron and the tip is 1 b or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature fcg 400 300 200 100 0 gradually cooling 350 c max 3 sec max 60 sec min ?)
precautions ferrite products 5 279 technical considerations stages precautions 6/7 2. cleaning conditions should be determined after verify- ing, through a test run, that the cleaning process does not affect the inductor's characteristics. 2. inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the inductors. (1)excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/ b ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 5.cleaning 7. handling s breakaway pc boards (splitting along perforations) 1. when splitting the pc board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. board separation should not be done manually, but by using the appropriate devices. s general handling precautions 1. always wear static control bands to protect against esd. 2. keep the inductors away from all magnets and mag- netic objects. 3. use non-magnetic tweezers when handling inductors. 4. any devices used with the inductors (soldering irons, measuring instruments) should be properly grounded. 5. keep bare hands and metal products (i.e., metal desk) away from chip electrodes or conductive areas that lead to chip electrodes. 6. keep inductors away from items that generate mag- netic fields such as speakers or coils. s mechanical considerations 1. be careful not to subject the inductors to excessive mechanical shocks. (1) if inductors are dropped on the floor or a hard surface they should not be used. (2)when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. s application of resin coatings, moldings, etc. to the pcb and components. 1. with some type of resins a decomposition gas or chemi- cal reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. when a resin's hardening temperature is higher than the inductor's operating temperature, the stresses gen- erated by the excess heat may lead to inductor dam- age or destruction. 3. stress caused by a resin? temperature generated ex- pansion and contraction may damage inductors. the use of such resins, molding materials etc. is not rec- ommended. 6. post cleaning processes precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s
precautions ferrite products 5 281 7/7 8. storage conditions 1. if the parts are stocked in a high temperature and humidity environment, prob- lems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this rea- son, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the in- ductors s storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. recommended conditions ambient temperature below 40 c humidity below 70% rh the ambient temperature must be kept below 30 c . even under ideal storage conditions inductor electrode solder- ability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *the packaging material should be kept where no chlo- rine or sulfur exists in the air. technical considerations stages precautions precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip bead s

▲Up To Search▲

Price & Availability of LGHK100547NJ

	To Download LGHK100547NJ Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .